The socket of Intel processors is usually called "LGA775", where "LGA" represents the packaging method of the processor, and "775" represents the number of contacts. Before the emergence of LGA775, the sockets of Intel and AMD processors were called "Socketxxx", where "Socket" actually means socket, and "xxx" means the number of pins. For example, Intel's LGA775 socket is also called Socket 775 or Socket T.

LGA775

Usually put Intel

LGA (LAND GRID ARRAY) is the packaging method of the INTEL64-bit platform. The contact array package is used to replace the old Socket 478 interface, also called SocketT, usually called

The single-core Pentium 4, Pentium 4 EE, Celeron D and dual-core Pentium D, Pentium EE, Core 2 and other CPUs in the LGA775 package are used for this interface. Unlike the previous Socket 478 interface CPU, the socket of the Socket 775 interface CPU does not have traditional pins at the bottom. Instead, it has 775 contacts, that is, not pin type but contact type. The stylus contacts to transmit the signal. The Socket 775 interface can not only effectively improve the signal strength and frequency of the processor, but also improve the yield of the processor and reduce the production cost. With the gradual fading of Socket 478, Socket 775 has become the standard interface for Intel desktop CPUs.

In addition, this change can effectively overcome the signal interference caused by pin contact. Because the traditional CPU uses pin package design, when the processor runs at high frequency, it will cause a lot of signal noise and product interference. In order to avoid these high-frequency noise interference, Intel redesigned the SocketT processor installation interface for the new generation platform. Although the new design solves some of the original problems, it also brings some unexpected disadvantages: the contacts on the SocketT socket are easily damaged and broken, which may cause the entire motherboard to be scrapped in serious cases.

Intel is therefore accused of adopting a pin-less design for its processors, in order to avoid a large number of products being damaged due to broken pins, which will increase the production cost of the processor. After the processor uses the LGA775 pin-less package, the risk can be passed on to the motherboard manufacturer. . Intel certainly did not respond positively to these rumors, but the company said it would strengthen the strength of the SocketT socket to reduce the chance of damage.

The new-generation processor moved from Socket478 to LGA775. Why is the purpose of adding a large number of pins? Some news indicates that it is used to expand the requirements of 128bit bus and is also reserved for the use of EM64T

The LGA775 CPU has no pins, only a few metal points, a total of 775. The pins of the LGA775 processor are actually made on the motherboard. There are 775 pins with certain flexibility on the motherboard. They can withstand these metal points to reach the CPU. The purpose of work.

Generally speaking, the processor with 462 architecture is 462 pins. 478 is 478 pins. 370 is 370 pins ... In this regard, Intel and

The LGA1156 socket used by the Lynnfield / Clarkdale processor is worth considering. Although it is clear

Because the production and yield of semiconductor chips are not high in the initial stage of production, chip manufacturers usually first concentrate their conversion into those flagship products with higher performance but lower output, until the output and yield of the chip reach a certain level of maturity. Later, it will spread to mainstream markets with larger shipments. For example, Intel has released its new generation based on as early as November 2008.

Prescott Pentium 4 505J, 506,520-570,520J-570J, 521-571

Prescott 2M Pentium 4 630-670,662-672

Cedar Mill Pentium 4 631-661

Prescott 256K Celeron D 325J-345J, 326-351

Prescott Pentium 4 Extreme Edition 3724MHz

Gallatin Pentium 4 Extreme Edition 3400 / 3466MHz

Smithfield Pentium D 805,820-840 S

mithfield Pentium Extreme Edition 840

Presler Pentium D 915,925,920-960

Presler Pentium Extreme Edition 950/960

Conroe Core 2 Duo E4300-4400, E63X0-68X0, Pentium Dual-Core E21X0-E2200

Conroe Core 2 Extreme, X6800

Conore Celeron Dual Core E1X00

Kentsfield Core 2 Quad, Q6600, Q6700

Kentsfield Core 2 Extreme, QX6700, QX6850, QX6800

Wolfdale Core 2 Duo E8X00 45nm

Wolfdale Core 2 Duo E7X00 45nm

Wolfdale Pentium Dual Core E5X00 45nm

Wolfdale Pentium Dual Core E6300 45nm

Y orkfield Core 2 Quad, Q8X00, Q9X00, Q9X50

Yorkfield Core 2 Extreme, QX9650, QX9770

product name	specification
Cooler Master Hyper Z200	Radiator type: CPU Radiator Cooling method: Air-cooled / Heat pipe fan Maximum number of revolutions: 1800 ± 10% RPM Bearing type: Alloy bearing Application range: Intel LGA1366 (optional) LGA775 Intel LGA1366 (optional) LGA775, AMD AM2 + / AM2 / 940/939/754
Overclocking Three South China Sea 5th Generation	Radiator type: CPU Radiator Cooling method: Air-cooled / Heat pipe fan Maximum number of revolutions: 1200-2500 ± 10% RPM Bearing type: Double ball bearing Scope of application: Compatible with AMD, INTEL LGA775 / LGA1156 / LGA1366 Maximum air volume of various platforms CFM): 47, 2-98.2 ± 10%
AVC Napoleon	Radiator type: CPU Radiator Cooling method: Air-cooled fan Maximum number of revolutions: 4000R.PM Bearing type: Hydraulic bearing Application range: Intal LGA775 560 (3.6GHz) and UP All Intel LGA775 Celeron D
AVC Alexander (Transparent Edition)	Radiator type: CPU Radiator Cooling method: Air-cooled / Heat pipe fan Maximum number of revolutions: 2800R.PM Bearing type: Hydraulic bearing Application range: Intel LGA775 571 (3.8GHz) All Intel LGA775 Celeron D Maximum air volume (CFM): 52.68
AVC Flame Heart	Radiator type: CPU Radiator Cooling method: Air-cooled / Heat pipe fan Maximum number of revolutions: 5400R.PM Bearing type: Patented hydraulic bearing (Hydraulic) Application range: Intel P4 LGA775 Prescott 3.4 GHz All Intel LGA775 Celeron D AMD AM2 CFM): 50
Overclocking Sannanhai MINI	Radiator type: CPU Radiator Cooling method: Maximum number of air-cooled fans: 2200R.PM Bearing type: Hydraumatic Scope of application: AMD / Intel LGA775 Maximum air volume (CFM): 40.3
AVC Napoleon (silent version)	Radiator type: CPU Radiator Cooling method: Air-cooled fan Maximum number of revolutions: 2800R.PM Bearing type: Hydraulic bearing Application range: Intel P4 LGA775 Full range maximum air volume (CFM): 50.61CFM
Overclocked Three Persian Gulf HP-1210	Radiator type: CPU Radiator Cooling method: Air-cooled / Heat pipe Application range: Intel LGA775, AMD AM2 AMD S-754 / 939/940
Cooler Extreme Cyclone V4	Radiator type: CPU Radiator Cooling method: Air-cooled / Heat pipe fan Maximum number of revolutions: 0 ~ 2800 ± 10% RPM Bearing type: Alloy bearing Application range: Intel LGA775 AMD AM2 / 754/939/940
Overclocking Three Red Sea Standard Edition HP-928	Radiator type: CPU Radiator Cooling method: Air-cooled / Heat pipe Bearing type: Hydraulic bearing Scope of application: Intel LGA775: Core 2 / Celeron / Pentium 4 / Pentium D AMD AM2 / S-754 / 939/940: Sempron / Athlon 64 / Athlon X2 / Zhenlong 64 Maximum Air Volume (CFM): 40.3 CFM
Zalman CNPS9500 LED 775	Radiator Type: CPU Radiator Cooling Method: Air-cooled / Heat Pipe Bearing Type: Double Ball Bearing Application: LGA775, 478 Platform
AVC Caesar the Great	Radiator type: CPU Radiator Cooling method: Air-cooled fan Maximum number of revolutions: 2800R.PM Bearing type: Hydraulic bearing Application range: Intal LGA775 560 (3.6 GHz) & All Intel LGA775 Celeron D Maximum air volume (CFM): 54.15 CFM
Overclocking Three Bluebirds 4	Radiator type: CPU radiator Cooling method: Air-cooled fan Maximum number of revolutions: 2,000 RPM ± 10% RPM Bearing type: Hydraumatic Scope of application: Intel LGA775 and AMD 754/939/940 / AM2 processor maximum air volume (CFM): 23 CFM
Kyushu Fengshen Hanguang Ice Armor	Radiator type: CPU Radiator Cooling method: Air-cooled fan Maximum number of revolutions: 1800RPM Scope: Intel LGA775 Maximum air volume (CFM): 71.09
Overclocking Three HP-937 Tokai	Radiator type: CPU Radiator Cooling method: Air-cooled / Heat pipe fan Maximum number of revolutions: 3000R.PM Scope of application: Intel LGA775, AMD 64 Bit (s-754 / 939/940), AMD AM2 Maximum Air Volume (CFM): 43.2 CFM
Cooler Supreme Ice Exquisite (Silent Version)	Radiator type: CPU Radiator Cooling method: Air-cooled fan Maximum number of revolutions: 2200R.PM Bearing type: Alloy bearing Application range: Intel LGA775 Conroe, PentiumD, Pentium4 Celeron D Maximum series airflow (CFM): 43CFM
Asus Royal Knight	Radiator type: CPU radiator Cooling method: Heat pipe fan Maximum number of revolutions: 1300R.PM Scope of application: Support LGA775 interface Core processor and AMD processor
Overclocking Three Red Sea Extreme Edition	Radiator type: CPU Radiator Cooling method: Air-cooled, Radiator fan Maximum number of revolutions: 900-2000 ± 10% RPM Bearing type: Hydraulic bearing Application range: INTEL LGA775 / 1366, AMD AM2 / 2 + / 3 Maximum air volume ( CFM): 17-38CFM
Gigabyte Volar	Radiator Type: CPU Radiator Cooling Method: Heatsink / Air Cooling Scope of Application: Suitable for LGA775 and AMD AM2 / K8 platforms
Tt BigTyp14Pro	Radiator type: CPU Radiator Cooling method: Air cooling Scope of application: CPUs that support LGA775 interface and AM2 / AM2 + interface
Simin VF2000	Radiator type: CPU radiator fan Maximum number of revolutions: 2350R.PM Bearing type: Double ball bearing Scope of application: AM2 / LGA775 platform or NVIDIA 6000 series
Overclocking Three Q Edition Golden Ant	Radiator type: CPU Radiator Cooling method: Air-cooled / finned fan Maximum number of revolutions: 2000RPMR.PM Scope of application: Support mainstream CPUs such as LGA775 and AM3
Dr. Thermal D-808	Radiator Type: CPU Radiator Fan Maximum Speed: 3100R.PM Scope: Up to Intel Core 2 Duo LGA775 E6700 Up to Intel Pentium 4 LGA775 550/551, 653 To Intel Celeron D LGA775 all series Maximum Air Volume (CFM): 38CFM
Cool Sky Waterfall Sword (6C61)	Radiator type: CPU Radiator Cooling method: Air-cooled fan Maximum number of revolutions: 860-3500R.PM Bearing type: Ball bearing Application range: Applicable CPU: Intel Core 2 Extreme X6800 Intel Core 2 E6300 ~ E6700 Intel LGA775 P4 653 Intel LGA775 P4 551 Intel LGA775 Celeron D series
Super Cool Cabernet Sword (6C65)	Radiator type: CPU radiator Cooling method: Air-cooled fan Maximum number of revolutions: 2500 +/- 10% RPM Bearing type: Super alloy bearing Application range: Intel Core 2 Extreme X6800 Intel Core 2 E6300 ~ E6700 Intel LGA775 P4 653 Intel LGA775 P4 551 Intel LGA775 Celeron D series

We saw the new LGA1155 interface for the first time in early 2009, but knew nothing about its purpose. Some people say that it and LGA1157 are only test interfaces. The final choice was LGA1156. However, according to Japanese PCWatch columnist Hiro Moto, the LGA1155 will be used in the future 32nm process new architecture Sandy Bridge family, and it will quickly spread It will become mainstream in two years.

If so, there will be four Intel desktop processor interfaces in recent years. The main uses and development trends are as follows:

-LGA775: It has been in service for many years and has undergone many changes. It is also the current mainstream platform, but it will be phased out within two years, and will only account for about 8% in the second half of 2011.

-LGA1366: Nehalem micro-architecture is only for high-end models, such as quad-core Bloomfield and six-core Gulftown. It will not be promoted. In the past two or three years, it will always only have a 2-3% share.

LGA1156: used by mainstream and low-end models of the Nehalem family, such as quad-core Lynnfield and dual-core 32nm Clarkdale, which appeared in the second half of 2009, occupying 40-50% from the second half of 2010 to the first half of the following year, but will soon give way It will be less than 25% in the second half of 2011.

-LGA1155: It will be used for the next-generation micro-architecture 32nm Sandy Bridge, similar to the positioning of LGA1156. Launched in 2011 will account for nearly 30%, and it will rapidly increase to 65% in the second half of the year.

Sandy Bridge uses the same 32nm production process as the upcoming Westmere family, but will upgrade the new architecture again, integrating graphics cores, DDR3 memory controllers, former Northbridge modules, etc. The mainstream quad-core chips have been successfully streamed in early June.

Sandy Bridge released in 2010 finally used the LGA1155 interface

The installation of the LGA775 interface processor requires extra care. Failure to pay attention may cause the motherboard Socket T socket to be damaged and scrapped.

1. Open the motherboard CPU socket: When opening and closing the loading lever, press the loading lever with your right thumb, otherwise the loading lever will pop up like a "mouse clip".

i. Depress the loading lever to release it from the hook

ii. Turn the loading lever to about 135 degrees to open it as far as possible

iii. Turn the loading cover to about 100 degrees to open it as far as possible

2. Remove the protective cover (pick & place cap)

i. Hold the loading cover with your left index finger and thumb, and then press the center of the protective cover with the right thumb to disengage it from the loading cover.

ii. Set the protective cover aside. If the processor is not installed in the socket, replace the protective cover.

iii. Check whether the protective cover is damaged, and replace it if damaged.

After the protective cover is removed, confirm that there are no other impurities in the slot loading cover and contacts; refer to the module impurity cleaning introduction

In addition, removing the protective cover after the cpu is inserted may hinder the inspection of the slot.

3. Visual inspection (it is recommended to pass at least one inspection)

Refer to "Module Operation and Inspection"

The gloves shown in the figure are for illustration only. In special cases, please refer to your local safety manual.

It is recommended not to hold the loading cover like the loading lever, press the label with your left hand, and remove the protective cover with your right hand.

4. Install lga 775 processor

1. You can only take the frame of the processor out of the package.

The direction to pick up the processor should be: the triangle is marked on the lower left and all marked keys are on the left.

2. Package cover: Remove the package cover with both hands.

3. Save the packaging cover.

When the processor is not in use, place it inside the package cover.

4. Check the processor's gold contacts: Check the processor's gold contacts for other impurities. Refer to Introduction to Module Impurity Cleaning and scan the processor's gold pad for foreign metal materials.

5. The processor's his top cover is up. Find pin 1 and two positioning notches.

6. Carefully place the processor vertically in the socket.

7. Check that the processor is seated in the socket in the correct orientation.

8. Close the slot

i. Pull down the loading cover onto the processor's top cover

ii. Gently hold the loading cover and snap the loading lever

iii. Make sure the loading cover is snapped under the protrusion of the loading lever

5. Remove the lga 775 processor

1. Open the loading lever and loading cover with both hands:

When removing the processor, hold the edge of the loading cover with your left index finger and thumb, and press the center of the protection cover with your right thumb to remove the cover.

2. Remove the lga 775 processor:

Using a vacuum pen: Place a minimum 9-inch cup-mouth vacuum pen in the center of the his lid

It is not recommended to use a vacuum pen on the edge of the his top cover. It may cause the processor to fall and hurt the contacts.

It is not recommended to use a vacuum pen to insert the cpu.

3. Lift the processor upright.

4. In order to prevent contamination, put it into the package cover immediately.

i. Hold the three top corners of the processor and the other hand with the package cover.

ii. Adjust the direction to match the No. 1 pin

iii. Apply force to the label and close the protective cover.

Return the processor with the protective cover to the box.

5. Check the slot

First step check

i. Observe whether there are impurities in the slot at different angles

ii. Do not use the motherboard or replace the socket if you cannot blow away the impurities or there is obvious mechanical damage (Class 1 or 4).

2. The second step check

i. Repeat all vertical and horizontal checks twice

ii. Check the second, third, and fifth questions

Reference module check details

6. Assemble the lga775 slot protection cover

i. Attach the back cover.

ii. Lower the cover for complete protection.

7. Close the slot

Intel recommends installation of heat sink

The heat sink assembly process depends on the configuration.

1. Place the motherboard on the work surface with a clearance of at least 0.150 inches from the work surface

2. Place a 300 mg heat sink (shin-etsu g751) on the top cover of his

There have been a lot of Mini-ITX motherboards using NVIDIA ION MCP7A ion chipset, but they are all aimed at Intel Atom processors. Although the system is lightweight, its performance is limited. AOpen is now the first to bring the ion chipset to the LGA775 platform, and it is still a mini board.

The motherboard model "nMCP7AUt-V", the chipset is a high-end MCP7A-U GeForce 9400, supports DX10.0, Hybrid SLI, GeForce Boost, PureVideo HD, PhysX and many other technologies, can be matched with the thermal design power consumption is not higher than 95W, Core 2 Duo / Quad / Extreme, Pentium, Celeron series processors up to 1333MHz, equipped with a PCI-E 2.0 x16 expansion slot, two DDR2-1066 / 800/667 SO- DIMM memory slot (maximum capacity 4GB), three SATA 3Gbps interfaces (RAID 0/1/5 / JBOD), Realtek ALC889 7.1 + 2-channel integrated sound card, Realtek RTL8211C Gigabit integrated network card.

The back interface has two PS / 2, six USB 2.0, DVI, HDMI. Unfortunately, no optical fiber and coaxial S / PDIF are provided, which is a pity for the HTPC.

What Is a Socket 775 Heatsink?

LGA775

Was this article helpful?